? semiconductor components industries, llc, 2001 september, 2001 rev. 0 1 publication order number: mbrs260t3/d mbrs260t3 surface mount schottky power rectifier smb power surface mount package . . . employing the schottky barrier principle in a metaltosilicon power rectifier. features epitaxial construction with oxide passivation and metal overlay contact. ideally suited for low voltage, high frequency switching power supplies; free wheeling diodes and polarity protection diodes. ? compact package with jbend leads ideal for automated handling ? highly stable oxide passivated junction ? guardring for overvoltage protection ? low forward voltage drop mechanical characteristics: ? case: molded epoxy ? epoxy meets ul94, vo at 1/8 ? weight: 95 mg (approximately) ? cathode polarity band ? lead and mounting surface temperature for soldering purposes: 260 c max. for 10 seconds ? available in 12 mm tape, 2500 units per 13 reel, add at3o suffix to part number ? finish: all external surfaces corrosion resistant and terminal leads are readily solderable ? esd ratings: machine model = c esd ratings: human body model = 3b ? marking: b26 maximum ratings rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 60 v average rectified forward current (at rated v r , t l = 95 c) i o 2.0 a nonrepetitive peak surge current (surge applied at rated load conditions halfwave, single phase, 60 hz) i fsm 40 a storage/operating case temperature t stg , t c 55 to +150 c operating junction temperature t j 55 to +125 c voltage rate of change (rated v r , t j = 25 c) dv/dt 10,000 v/ s device package shipping ordering information smb case 403a plastic http://onsemi.com mbrs260t3 smb 2500/tape & reel schottky barrier rectifier 2.0 amperes 60 volts marking diagram b26 b26 = device code
mbrs260t3 http://onsemi.com 2 thermal characteristics characteristic symbol value unit thermal resistance junctiontolead (note 1.) thermal resistance junctiontoambient (note 2.) r q jl r q ja 24 80 c/w electrical characteristics maximum instantaneous forward voltage (note 3 ) v f t j = 25 c t j = 125 c volts m ax i mum i ns t an t aneous f orwar d v o lt age (n o t e 3 . ) (i f = 1.0 a) (i f = 2.0 a) 0.51 0.63 0.475 0.55 maximum instantaneous reverse current (note 3.) i r t j = 25 c t j = 125 c ma maximum instantaneous reverse current (note 3 . ) (v r = 60 v) 0.2 10 1. mounted with minimum recommended pad size, pc board fr4. 2. 1 inch square pad size (1 x 0.5 inch for each lead) on fr4 board. 3. pulse test: pulse width 250 m s, duty cycle 2.0%. figure 1. typical forward voltage 0.1 0.2 0.4 0.7 0.6 10 0.1 1 i f , instantaneous forward current (amps) v f , instantaneous forward voltage (volts) figure 2. maximum forward voltage 0.2 0.8 0.4 0.6 0.3 0.5 10 0.1 1 v f , instantaneous forward voltage (volts) i f , instantaneous forward current (amps) figure 3. typical reverse current 10 30 02040 i r , reverse current (amps) v r , reverse voltage (volts) figure 4. typical capacitance 75 c 25 c 1.0e02 125 c 75 c 25 c 10 30 02040 10 c, capacitance (pf) v r , reverse voltage (volts) 0.3 0.5 0.8 125 c 75 c 25 c 125 c 60 50 50 60 100 0.7 0.1 1.0e03 1.0e04 1.0e05 1.0e06 1.0e07 25 c f = 1 mhz
mbrs260t3 http://onsemi.com 3 figure 5. current derating junction to lead 70 90 60 80 100 1.5 i f , average forward current (a) t l , lead temperature ( c) figure 6. forward power dissipation 2.5 3 3.5 0.5 1.5 01 2 0 0.2 p fo , average power dissipation (w) i o , average forward current (amps) 0.4 0.6 120 110 130 2.5 3 1 1.8 2 0 0.5 1 2 dc square wave 0.8 1.2 1.4 1.6 dc square wave figure 7. thermal response junction to case figure 8. thermal response junction to ambient 0.1 0.00001 t, time (s) 1.0e+00 1.0e01 1.0e02 1.0e03 1.0e04 0.0001 0.001 0.01 1.0 10 100 1000 50% 20% 10% 5.0% 2.0% 1.0% r tjl(t) = r tjl*r(t) t, time (s) 1.0e+00 1.0e01 1.0e02 1.0e03 1.0e04 50% 20% 10% 5.0% 2.0% 1.0% r t , transient thermal resistance (normalized) r t , transient thermal resistance (normalized) 0.1 0.00001 0.0001 0.001 0.01 1.0 10 100 1000 r tjl(t) = r tjl*r(t)
mbrs260t3 http://onsemi.com 4 package dimensions smb plastic package case 403a03 issue d a s d b j p k c h notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. d dimension shall be measured within dimension p. dim min max min max millimeters inches a 0.160 0.180 4.06 4.57 b 0.130 0.150 3.30 3.81 c 0.075 0.095 1.90 2.41 d 0.077 0.083 1.96 2.11 h 0.0020 0.0060 0.051 0.152 j 0.006 0.012 0.15 0.30 k 0.030 0.050 0.76 1.27 p 0.020 ref 0.51 ref s 0.205 0.220 5.21 5.59 minimum solder pad sizes mm inches 0.085 2.159 0.108 2.743 0.089 2.261 on semiconductor and are trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. atypicalo parameters which may be provided in scill c data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including atypicalso must be validated for each customer application by customer's technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body , or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthori zed use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. publication ordering information japan : on semiconductor, japan customer focus center 4321 nishigotanda, shinagawaku, tokyo, japan 1410031 phone : 81357402700 email : r14525@onsemi.com on semiconductor website : http://onsemi.com for additional information, please contact your local sales representative. mbrs260t3/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 3036752175 or 8003443860 toll free usa/canada fax : 3036752176 or 8003443867 toll free usa/canada email : onlit@hibbertco.com n. american technical support : 8002829855 toll free usa/canada
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